Solution Manual for Science and Engineering of Materials, SI Edition, 7th Edition
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Chapter 2: Atomic Structure
2-1
What is meant by the term composition of a material?
Solution:
The chemical make-up of the material.
2-2
What is meant by the term structure of a material?
Solution:
The spatial arrangement of atoms or ions in the material.
2-3
What are the different levels of structure of a material?
Solution:
Atomic structure, short- and long-range atomic arrangements, nanostructure,
microstructure, and macrostructure.
2-4
Why is it important to consider the structure of a material when designing and
fabricating engineering components?
Solution:
The structure of the material at all levels will affect the physical and mechanical
properties of the final product.
2-5
What is the difference between the microstructure and macrostructure of a material?
Solution:
A length scale of about 100,000 nm (100 ฮผm) separates microstructure (less than
100,000 nm) from macrostructure (greater than 100,000 nm).
2-6
(a) Aluminum foil used for storing food weighs about 0.3 grams per square inch. How
many atoms of aluminum contained in one square inch of the foil? (b) Using the
densities and atomic weights given in Appendix A, calculate and compare the number of
atoms per cubic centimeter in (i) lead and (ii) lithium.
Solution:
(a)
= 1 in.
0.3 g Al
1 mol Al 6.022 ร 10 atoms
#
1 in. 26.982 g Al
1
mol
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= 6.7 ร 10% Al atoms
(b)
11.36 g Pb
1 mol Pb 6.022 ร 10 atoms
=
#
1 cm 207.19 g Pb
1
mol
= 33.0 ร 10%
=
0.534 g Li
1 mol Li 6.022 ร 10 atoms
#
1
1 cm 6.94 g Li
mol
= 46.3 ร 10%
2-7
Pb atoms
cm
Li atoms
cm
(a) Using data in Appendix A, calculate the number of iron atoms in one ton (2000
pounds). (b) Using data in Appendix A, calculate the volume in cubic centimeters
occupied by one mole of boron.
Solution:
=
2000 lb 454 g
1 mol Fe 6.022 ร 10 atoms
#
1 ton
1 lb 55.847 g Fe
mol
1
= 9.8 ร 10.
Fe atoms
ton
10.81 g B
1 cm B
/ = 1 mol B
#
1 mol B 2.36 g B
/ = 4.58 cm B
2-8
In order to plate a steel part having a surface area of 200 in.2 with a 0.002 in.-thick layer
of nickel: (a) how many atoms of nickel are required? (b) How many moles of nickel are
required?
Solution:
(a)
We start with the volume required:
/ = 200 in.
0.002
2.54 cm
in.
= 6.55 cm
1 in.
14
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= 6.55 cm
8.902 g Ni
1 mol Ni 6.022 ร 10 atoms
#
1 cm 58.71 g Ni
1
mol
= 598 ร 10% atoms Ni
(b)
8.902 g Ni
1 mol Ni
23 = 6.55 cm
1 cm
58.71 g Ni
23 = 0.99 mol Ni
2-9
Define electronegativity.
Solution:
Electronegativity is the tendency of an atom to accept an electron (which has a negative
charge) and become an anion.
2-10
Write the electronic configuration of the following elements (a) tungsten, (b) cobalt, (c)
zirconium, (d) uranium, and (e) aluminum.
Solution:
(a) W: [Xe] 4f145d46s2
(b) Co: [Ar] 3d74s2
(c) Zr: [Kr] 4d24s2
(d) U: [Rn] 5f36d17s2
(e) Al: [Ne] 3s23p1
2-11
Write the electron configuration for the element Tc.
Solution:
Since Technetium is element 43:
[Tc] = 1s22s22p63s23p64s23d104p65s24d5
2-12
Assuming that the Aufbau Principle is followed, what is the expected electronic
configuration of the element with atomic number Z = 116?
Solution:
Using the Aufbau diagram produces:
[116] = 1s22s22p63s23p64s23d104p65s24d105p66s24f145d106p67s25f146d107p4
Or in shorthand:
15
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[116] = [Rn] 5f146d107s27p4
2-13
Using the Aufbau Principle, what is the expected electronic configuration of the
hypothetical element with atomic number Z = 123?
Solution:
Using the Aufbau diagram produces:
[123] = 1s22s22p63s23p64s23d104p65s24d105p66s24f145d106p67s25f146d107p68s25g3
Or in shorthand:
[123] = [Rn] 5f145g36d107s27p68s2
Or assuming that [118] is another inert gas:
[123] = [118] 5g38s2
2-14
Suppose an element has a valence of 2 and an atomic number of 27. Based only on the
quantum numbers, how many electrons must be present in the 3d energy level?
Solution:
We can let x be the number of electrons in the 3d energy level. Then:
1s22s22p63s23p63dx4s2 (must be 2 electrons in 4s for valence = 2)
Since 27 – (2 + 2 + 6 + 2 + 6 + 2) = 7 = x there must be 7 electrons in the 3d level.
2-16
Bonding in the intermetallic compound Ni3Al is predominantly metallic. Explain why
there will be little, if any, ionic bonding component. The electronegativity of nickel is
about 1.8.
Solution:
The electronegativity of Al is 1.5, while that of Ni is 1.9. These values are relatively close,
so we wouldnโt expect much ionic bonding. Also, both are metals and prefer to give up
their electrons rather than share or donate them.
2-17
Plot the melting temperatures of elements in the 4A to 8โ10 columns of the periodic
table versus atomic number (i.e., plot melting temperatures of Ti through Ni, Zr through
Pd, and Hf through Pt). Discuss these relationships, based on atomic bonding and
binding energies: (a) as the atomic number increases in each row of the periodic table
and (b) as the atomic number increases in each column of the periodic table.
16
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Solution:
The melting temperatures are taken from Figure 2-9 and are plotted below:
Melting temperature v. atomic number
Melting temperature (ยฐC)
4000
3500
3000
2500
2000
1500
1000
500
0
Ti – Ni
Zr – Pd
Hf – Pt
For each row, the melting temperature is highest when the outer โdโ energy level is
partly full. In Cr, there are 5 electrons in the 3d shell; in Mo, there are 5 electrons in the
4d shell; in W there are 4 electrons in the 5d shell. In each column, the melting
temperature increases as the atomic number increasesโthe atom cores contain a larger
number of tightly held electrons, making the metals more stable.
2-18
Plot the melting temperature of the elements in the 1A column of the periodic table
versus atomic number (i.e., plot melting temperatures of Li through Cs). Discuss this
relationship, based on atomic bonding and binding energy.
Solution:
Using data from Figure 2-9:
17
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Melting temperature (ยฐC)
Melting point as a function of atomic number
200
180
160
140
120
100
80
60
40
20
0
0
10
20
30
40
50
60
Atomic number (Z)
As the atomic number increases, the melting temperature decreases, in contrast to the
trend found in Problem 2-17.
2-19
Compare and contrast metallic and covalent primary bonds in terms of (a) the nature of
the bond, (b) the valence of the atoms involved, and (c) the ductility of the materials
bonded in these ways.
Solution:
(a) Metallic bonds are formed between the one or two free electrons of each atom. The
free electrons form a gaseous cloud of electrons that move between atoms. Covalent
bonds involve the sharing of electrons between atoms.
(b) In metallic bonding, the metal atoms typically have one or two valence electrons that
are given up to the electron โsea.โ Covalent bonds form between atoms of the same
element or atoms with similar electronegativities.
(c) Metallic bonds are nonโdirectional. The nonโdirectionality of the bonds and the
shielding of the ions by the electron cloud lead to high ductilities. Covalent bonds are
highly directional โ this limits the ductility of covalently bonded materials by making it
more difficult for the atoms to slip past one another.
2-20
Differentiate the three principle bonding mechanisms in solids. What is Van der Waalโs
bonding? What are the relative binding energies of the different mechanisms?
Solution:
The principle bonding mechanisms are covalent, ionic and metallic. Van der Waals
bonding is a weak secondary bonding mechanism that allows some gaseous or small
molecules to condense. The relative binding energies of the primary bonds are reflected
18
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in the strength of the material. Covalent and ionic bonds produce the strongest bonds
while metallic bonds have lower bonding energies than covalent or ionic materials.
2-21
What type of bonding does KCl have? Fully explain your reasoning by referring to the
electronic structure and electronic properties of each element.
Solution:
KCl has ionic bonding. The electronic structure of [K] = 1s22s22p63s23p64s1 = [Ar] 4s1. The
electronic structure of [Cl] = 1s22s22p63s23p5 = [Ne] 3s23p5. Therefore, K wants to give up
its 4s1 electron in order to achieve a stable s2p6 configuration, and Cl wants to gain an
electron in order to gain the stable s2p6 configuration. Thus an electron is transferred
from K to Cl, and the bonding is ionic.
2-22
The compound aluminum phosphide (AlP) is a compound semiconductor having mixed
ionic and covalent bonding. Calculate the fraction of bonding that is ionic.
Solution:
Starting with Equation 2-1, we determine the fraction of ionic bonding with this
equation:
45657 = 1 โ 9 :;<.=โ? A
@
The exponential term is the covalent fraction. Since there can be only ionic or covalent
bonds, the two fractions must add to 1. In an equation form:
45657 + 47C236 = 1
Or:
45657 + 9 :;<.=โ? A = 1
@
Anyway, the electronegativities for Al and P are 1.5 and 2.1 respectively. The difference
is 0.6:
45657 = 1 โ 9 :;<.=D<.EF A
@
Doing the math:
45657 = 0.086
So less than one tenth of the bonding is ionic. This should not be surprising when their
positions in the periodic table are compared.
2-23
Calculate the fraction of bonding in MgO that is ionic.
19
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Solution:
Starting with Equation 2-1, we determine the fraction of ionic bonding with this
equation:
45657 = 1 โ 9 :;<.=โ? A
@
The electronegativities of magnesium and oxygen are 1.2 and 3.5, so their difference is
2.3. Inserting:
45657 = 1 โ 9 :;<.=D.F A
@
Math time!
45657 = 0.734
The compound is held together mostly by ionic bonding.
2-24
Calculate the fraction of bonding that is covalent for silica (SiO2).
Solution:
Using Equation 2-1, we determine the fraction of covalent bonding:
47C236 = 9 :;<.=โ? A
@
The electronegativities of silicon and oxygen are 1.8 and 3.5, so their difference is 1.7.
Inserting:
47C236 = 9 :;<.=D%..F A
@
47C236 = 0.486
2-25
Calculate the fraction of bonding that is ionic in nature for zirconia (ZrO2)?
Solution:
45657 = 1 โ 9 :;<.=โ? A
@
The electronegativities of zircon and oxygen are 1.4 and 3.5, so their difference is 2.1.
Inserting:
45657 = 1 โ 9 :;<.=D.%F A
@
45657 = 0.668
2-26
What is the type of bonding in diamond? Are the properties of diamond commensurate
with the nature of the bonding?
20
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Solution:
In diamond, the carbon atoms are covalently bonded. Diamond is electrically insulating,
which makes sense: each carbon is bonded to four other carbon atoms thus leaving no
free valence electrons available to conduct electricity.
2-27
What are the bonding mechanisms in thermoplastics?
Solution:
The primary bond in thermoplastics are the covalent bonds that hold the individual
carbon atoms together along the polymer chains while van der Waals secondary bonds
hold the polymer chains close together.
2-28
Why are covalently bonded materials generally less dense than those that are bonded
ionically or metallically?
Solution:
Covalently bonded materials are typically less dense than metallically or ionically
bonded materials due to the nature of their bonding. The bonding in covalent materials
is directional in nature which doesnโt allow the atoms to pack together in a dense
manner like the ionic or metallic bonded materials. This results in a lower mass and
lower density for covalently bonded materials.
2-31
Calculate the fractions of ionic bonds in silicon carbide (SiC) and silicon nitride (Si3N4).
Solution:
We use Equation 2.1 and take the electronegativities from Figure 2-9:
45657 = 1 โ 9 :;<.=โ? A
@
The electronegativities of silicon and carbon are 1.8 and 2.5, so their difference is 0.7.
Inserting:
45657 = 1 โ 9 :;<.=D<..F A
@
Math time!
45657 = 0.115
Repeating this for silicon nitride:
45657 = 1 โ 9 :;<.=โ? A
@
The electronegativities of silicon and nitrogen are 1.8 and 3.0, so their difference is 1.2.
Inserting:
45657 = 1 โ 9 :;<.=D%.F A
@
21
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45657 = 0.302
2-32
One particular form of boron nitride (BN) known as cubic boron nitride is a very hard
material and is used in grinding applications. Calculate the fraction of bonding that is
covalent in this material.
Solution:
Using Equation 2-1, we determine the fraction of covalent bonding:
47C236 = 9 :;<.=โ? A
@
The electronegativities of boron and nitrogen are 2.0 and 3.0, so their difference is 1.0.
Inserting:
47C236 = 9 :;<.=D%.<F A
@
47C236 = 0.779
2-34
Is there a trend in the number of electrons in the outermost energy shell of atoms or
ions that have formed bonds?
Solution:
Yes. They try to fill their valence shells.
2-35
In order to increase the operating temperature of an engine, it is suggested that some of
the aluminum components be coated with a ceramic. What kinds of problems could this
pose? How could you overcome these problems?
Solution:
Creating a mechanical bond between the ceramic and the metallic component could
pose a problem since the ceramic is ionic in nature and the component is metallically
bonded. This can be overcome by creating a slightly roughened surface and choosing a
ceramic that has a limited degree of chemical reactivity with the metal which would
enhance bonding.
Another problem that we face is likely to spallation or debonding of the coating due to
the differences in the coefficients of thermal expansion. To overcome this problem, it
would be possible to select a ceramic that could have a compatible coefficients of
thermal expansion with the aluminum for the given operating temperature range.
2-36
Aluminum and silicon are side by side on the periodic table. Compare the melting
temperatures of the two elements and explain the difference in terms of atomic
bonding.
22
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Solution:
The melting temperature of silicon is 1410ยฐC while aluminum is 660ยฐC. The differences
in melting temperatures can be explained by the types of bonds that bind the elements
together. It is expected that since aluminum is a metal that it would have metallic
bonding. Silicon on the other hand is a metalloid (between metal and non-metal) and
has covalent bonding. Since covalent bonding has higher binding energy than metallic
bonding, we can conclude that the silicon has the higher melting temperature due to
the higher strength of the silicon bonds when compared to aluminum.
2-37
Titanium is stiffer than aluminum, has a lower thermal expansion coefficient than
aluminum, and has a higher melting temperature than aluminum. On the same graph,
carefully and schematically draw the potential well curves for both metals. Be explicit in
showing how the physical properties are manifest in these curves.
Solution:
The well of titanium, represented by A, is deeper (higher melting point), has a larger
radius of curvature (stiffer), and is more symmetric (smaller thermal expansion
coefficient) than the well of aluminum, represented by B.
2-38
Would you expect iron or silicon nitride (SiN) to have a higher modulus of elasticity?
Why?
Solution:
It is expected that SiN would have the higher modulus of elasticity due to its bonding
nature (covalent) compared to iron (metallic). Covalent bonds result in higher binding
energies thus having a direct result for a higher modulus of elasticity.
2-39
Beryllium and magnesium, both in the 2A column of the periodic table, are lightweight
metals. Which would you expect to have the higher modulus of elasticity? Explain,
considering binding energy and atomic radii and using appropriate sketches of force
versus interatomic spacing.
Solution:
The smaller Be electrons are held closer to the core, therefore โด held more tightly,
giving a higher binding energy:
4 Be 1s22s2 E = 42 ร 106 psi rBe = 1.143 ร
12 Mg 1s22s22p63s2 E = 6 ร 106 psi rMg = 1.604 ร
2-41
Would you expect MgO or magnesium to have the higher modulus of elasticity? Explain.
23
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Solution:
MgO has ionic bonds. A higher force will be required to cause the same separation
between the ions in MgO compared to the atoms in Mg. Therefore, MgO should have
the higher modulus of elasticity. In Mg, E โ 6 ร 106 psi; in MgO, E โ 30 ร 106 psi.
2-43
Aluminum and silicon are side-by-side in the periodic table. Which would you expect to
have the higher modulus of elasticity? Explain.
Solution:
Silicon has covalent bonds; aluminum has metallic bonds. Therefore, Si should have a
higher modulus of elasticity.
2-45
Steel is coated with a thin layer of ceramic to help protect against corrosion. What do
you expect to happen to the coating when the temperature of the steel is increased
significantly? Explain.
Solution:
Ceramics are expected to have a low coefficient of thermal expansion due to strong
ionic/covalent bonds; steel has a high thermal expansion coefficient. When the
structure heats, steel expands more than the coating, which may crack and expose the
underlying steel to corrosion.
2-48
Name at least four allotropes of carbon. Why is graphite electrically conductive while
diamond is not if both are pure forms of carbon?
Solution:
The four allotropes of carbon are diamond, graphite, nanotubes and
buckminsterfullerene. In diamond, the carbon atoms are covalently bonded to four
other carbon atoms thus leaving no free valence electrons available to conduct
electricity. In graphite, the carbon is arranged in layers where the carbon atoms form 3
strong bonds with other carbon atoms, but have a fourth bond between layers which is
a weak van der Waals bond. This results in the fourth electron for each of the carbon
atom to be available to conduct electricity.
2-49
Bond hybridization in carbon leads to numerous crystalline forms. With only six
electrons, how is this possible? Explain.
Solution:
Carbon in graphite form has the electron configuration of 1s2 2s2 2p2 which only allows
for 3 bonds. Additions of pressure and heat, hybridization occurs to the point that the
electron moves from the 2s to the 2p orbital (1s2 2s1 2p3) allowing access for 4 bonds to
occur.
24
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